黄双武 兼职教授
发表时间:2017-03-10 阅读次数:280次

黄双武 博士

电邮:swhuang225@hotmail.com

手机: 18761960488

住址:  # 04-25,29 Rosewood Drive,Singapore 737921

 

教育和工作经历

1984-1991   合肥工业大学高分子材料工程学士(1988)和硕士(1991)

                     研究方向:碳纤维增强材料用于人体骨骼修补

1991-1993    江苏仪征化纤技术中心工程师,负责涤纶树脂的表征

1993-1996    中国科学院化学所高分子化学博士(1996)

研究方向:刚性高分子和柔性基体纳米复合材料的合成和应用

1996-1998   新加坡国立大学化工系博士后, 研究方向:导电高分子纳米复合材料的合成和应用

 

1999-2000   Hitachi Chemical (日立化成) 亚太私人公司,高级工艺工程师

           负责高密度印刷电 路板的光刻和电镀

2001-2008   Micron Technology (美国美光科技)有限公司封装部, 首席工程师 兼高级主管,

                     负责半导体封装材料(Semiconductor Packaging Materials)用于先进封装工艺

                     如 FCIP,TSOP,Lead-frame BGA, Cu-Pillar Interconnection 和CIS 封装等

2008-2009    STATSChipPAC (新科封装) 公司研发部,首席技术顾问兼高级经理,

                     负责半导体封装材料和新工艺的研发等

 2009-2009 Brewer Science (美国布鲁尔科技)私人有限公司技术部,首席技术顾问兼高级经理

                    负责半导体封装材料的研发和市场应用

2009-2011 Institute of Microelectronics (新加坡微电子所) 技术顾问, 3D-TSV项目主要负责人;

                   微型医用器件项目主要负责人

2011-2014 Unisteel Technology Limited (新加坡联钢科技) 技术开发和市场总监, 负责与消费

                  电子产品和微电子封装新材料和表面技术的研发和市场

2014-现在  硕贝德集团(SPEED GROUP)首席技术官(CTO), 负责新材料和晶圆级封装新

                  技术的开发和市场

2015-现在  上海交通大学仪器系兼职教授


 

发表论文

                 国内外杂志50余篇,多次受邀参加国际专题会议,分会主席并演讲

部分半导体封装领域学术论文:

  • Mark Huang, Wang Ping etc., “TSV fabrication for CIS packaging”, China Semiconductor Technology International Conference (CSTIC), 16-17 March 2015, in Shanghai, CHINA
  • Mark Huang, Charles Chu and Freddy Lim, “Hermetic Open cavity Substrates for MEMS and SiP packages”, China Semiconductor Technology International Conference (CSTIC), 18-19 March 2013, in Shanghai, CHINA
  • Mark Huang, Freddy Lim and Charles Chu, “Development of Hermetic Liquid Crystalline Polymers for Electronic Packages”, 14th Electronics Packaging Technology Conference (EPTC), 5 to 7 December 2012 at Resorts World Sentosa, Singapore, 2012
  • Ser Choong Chong, Huang Shuangwu and Faxing Che, “Wafer Level Molding of 3D TSV Stack Module” 12th International Conference on Electronics Materials and Packaging, October 25-27, (Singapore) 2010
  • Vincent LEE, Jaesik LEE and Mark HUANG, “Ultra-thin Wafer Processing for 3D-TSV Applications” 12th International Conference on Electronics Materials and Packaging, October 25-27, (Singapore) 2010
  • Yen Chen Yeo, Mark Huang and Fa Xing Che, “Solder Joint Encapsulation and Reliability using Dippable Underfill”, 12th Electronics Packaging Technology Conference (EPTC), Singapore, 2010
  • Mark Huang and Jeus Lim, “Capillary Underfills and Non-conductive Film for 3D-TSV Stacking”

12th Electronics Packaging Technology Conference (EPTC), 2010

  • Mark Huang and Yeo Yen Chen, “Wafer Level Underfill for 3D Fine-gap and Thin Die Packages”, 12th Electronics Packaging Technology Conference (EPTC), 2011
  • Mark Huang, Vincent Lee and Jaesik Lee, “Ultra-thin Wafer Processing for Fine-gap / Pitch 3D-TSV Packaging”, Journal of Electronic Materials, in 2010
  • Mark Huang, Jaspreet Gandi, Shijian Luo and Tom Jiang, “Die Attach Materials for High-density Memory Stacked Die Packaging”, pp 1569-1575, Electronic Components and Technology Conference (ECTC) May 27-30, 2008
  • Mark Huang, Ong Gee Yeow, Chia Yong Poo and Tom Jiang, “Intermetallic Formation of Copper Pillar with Sn-Ag-Cu Alloys for Flip-Chip-On-Module Packaging, IEEE Transactions on Components and Packaging Technologies, Vol.31 No.4, December 2008
  • Mark Huang Shuangwu, David Li, S. Nathapong and Pandi M.  "Temporary Bonding of Wafer to Carrier for 3D Wafer Level Packaging", 10th Electronics Packaging Technology Conference (EPTC), Singapore, Dec 9-12, 2008
  • Mark Huang, Ong Gee Yeow, Chia Yong Poo and Tom Jiang, “Copper Pillar Interconnection for Flip-Chip-on-Module Packaging, 4th International Wafer Level Packaging (IWLP) Conference, CA, 17-19 September, 2007
  • Mark Huang, and Chia Yong Poo, “A study on Cu-Pillar Interconnect in FCOM Packaging”, December, Singapore EPTC 2007
  • Mark Huang, “Study on Cu-pillar interconnection for Flip-Chip-on-Module Packaging”, SMTA 3D/SiP Advanced Packaging Symposium, NC of USA, May 9-10, 2007
  • Mark Huang, “Study on Adhesives for Silicon to Substrate Bonding”, MSA Assembly, Jan 15, 2007
  • Xiaoyan Chen and Shuangwu HUANG, “Carbon Nanotubes and Application in IC packaging”, Micron Internal Paper, August 2007
  • Mark Huang, “Carbon Nanotubes for Electronic Devices”, Micron Internal Paper, Nov. 2007
  • Mark Huang, and Chia Yong Poo, “Fabrication of Tapered Through-via on (100) Silicon for Wafer Level Packaging” 3rd International Wafer Level Packaging (IWLP), San Jose of CA, USA, Nov.02-03, 2006
  • Mark Huang and Yongpoo Chia “Low Temperature PECVD SiO2/Si3Nas Etch Mask for Silicon Through-via Fabrication”, Micron Semiconductor Asia 12th Technical Seminar, 17, Oct 2006
  • Mark Huang, “Study on Epoxy-resin-based Molding Compounds for IC Packaging”, Micron Internal Publishing Project, July of 2005
  • Huang Shuangwu, Chia Yongpoo, Low Siu Waf and Wong Mee Mee, “Thermal and Mechanical Behaviors of Underfills for Flip Chip packaging”, Proceeding of 7th Electronics Packaging Technology Conference, 7-9 Dec 2005 in Singapore
  • Tan, B. K., Huang M., Wei J.,“Effect of Mask Patterns Optimization and Silicon Surface Preparation for Anisotropic Silicon Etching”, Proceeding of 7th Electronics Packaging Technology Conference, 7-9 Dec 2005 in Singapore
  • Zhou Wei, Low Siu Waf, Neo Yong Loo, Eng Meow Koon, Huang M. “Studies on Moisture-induced Failure in ACF Interconnection”, Proceeding EPTC 2002, 4th Electronics Packaging Technology Conference, Dec. 2002 (Singapore) –Best Paper
  • Zhou Wei, Siu Waf Low and Mark Huang, “Generic Study on Package Reliability Performance of Flip Chip In Package using ACF”, Micron Semiconductor Asia 8th Technical Seminar, 2002 –Best Paper
  • Mark Huang, and S J Boon, “Study on Dry-etch BCB for Wafer Level Packaging”, Micron Semiconductor Asia 8th Technical Seminar, 2002 –Merit Paper
  • Mark Huang, and Low Siu Waf, “Study on ACF/NCF for Flip Chip Interconnection”, Micron Semiconductor Asia 7th Technical Seminar, 2001 ---Merit Paper
  • Neo Yong Loo, Eng Meow Koon,  Mark Huang, Low Siu Waf, “Flip Chip in Packaging Development Using Anisotropic Conductive Film”, Micron Semiconductor Asia 7th Technical Seminar, 2001

复合材料学术论文:

  • Yangling Wang, Rongrong Qi and Mark Huang, “Biodegradable Composites from Poly(lactic acid) and Wood Flour”, J. Appl. Polym. Sci. (accepted) 2008
  • Rongrong Qi, Qiaochu Liu, Yangling Wang and Mark Huang, Properties of Poly(ethylene 1-octene)-g-maleic Anhydride Copolymers Prepared via Solvothermal Process”, J. Appl. Polym. Sci. (accepted) 2008
  • Rongrong Qi, Xing Jin and Shuangwu HUANG “Synthesis and Characteristics of Polystyrene-clay Nanocomposites via In-situ Intercalative Polymerization in a Direct Current Electric Field”, J. Appl. Polym. Sci. (accepted) 2008
  • Ling Fang, Rongrong Qi, Linbo Liu, Wenjuan Gong and Shuangwu Huang "Synthesis of Poly (L-lactide) via Solvothermal Method," International Journal of Polymer Science ,(accepted) 2009

 

微纳复合材料论文:

  • Xiaoyan Chen and Shuangwu HUANG, “Carbon Nanotubes and Application in IC packaging”, Micron Internal Paper, August 2007
  • Mark Huang, “Carbon Nanotubes for Electronic Devices”, Micron Internal Paper, Nov. 2007
  • Huang Shuangwu, Wu Meiyan and ZhangShufan, “Aromatic Polyamide (or Polyester)-containing Microcomposites by in-situ polycondensation, Part 1 Research Progress on Molecular Composites”, Synthetic Technology and Application (CHN), vol 20 No 2, June 2005
  • Huang Shuangwu, Wu Meiyan and Zhang Shufan “Aromatic Polyamide (or Polyester)-containing Microcomposites by in-situ polycondensation, Part II Influence of Matrix Polymer Solvents on the Properties and Morphology of Microcomposites”, Synthetic Technology and Application (CHN), vol . 20 No 3, Sept. 2005
  • Huang Shuangwu, Wu Meiyan and Zhang Shufan, “Aromatic Polyamide (or Polyester)-containing Microcomposites by in-situ polycondensation, Part III Study on PPTA/PBT-PTMG Microcomposites”, Synthetic Technology and Application (CHN), vol 20 No 4, Dec. 2005
  • Huang Shuangwu, Wu Meiyan and ZhangShufan, “Aromatic Polyamide (or Polyester)-containing Microcomposites by in-situ polycondensation, Part IV Synthesis of Poly(p-phenylene terephthalamide)/Polysulfone Microcomposites” Synthetic Technology and Application (CHN), vol 21 No 1, March. 2006
  • Huang Shuangwu, Wu Meiyan and ZhangShufan, “Aromatic Polyamide (or Polyester)-containing Microcomposites by in-situ Polycondensation, Part V, Synthesis of Aromatic-aliphatic copolyamide/Polysulfone Microcomposites”, Synthetic Technology and Application (CHN), vol. 21 No 3, Sept. 2006
  • Neoh K.G., Tan K.K., Goh P.L., Huang S.W. “Electroactive Polymer-SiO2 Nanoparticles for Metal Uptake”, Polymer 40:(4) 887-893, 1999
  • S.W. Huang, K.G. Neoh, E.T. Kang, H.S. Han and K.L.Tan, “Palladium-Containing Polyaniline and Polypyrrole Nanoparticles” Journal of Materials Chemistry 8: (8)1743-1748 Aug. 1998
  • S.W. Huang, K.G. Neoh, C.W.Shih, D.S.Lim, E.T. Kang, H.S. Han and K.L.Tan, “Synthesis, Characterization and Catalytic Properties of Palladium-containing Electroactive Polymers”, Synthetic Metals 96: (2) 117-122 July 30 1998
  • E.T. Kang, K.G. Neoh, S.W. Huang, S.L. Lim and K.L.Tan, “Surface-Functionalized Polyaniline Films”, J. Phys. Chem. B, 101, 10744-10750, 1997

 

碳纤维复合材料论文:

  • Weibin Xu, Rongfu Jin and Shuangwu Huang, and Shiwang Zhu,Shunagwu HUANG, “Study on the Physical and Mechanical Properties of Carbon Fibers Reinforced Polysulfones for Skull Prosthesis”, Journal of Functional Polymer CHN), 2. 1995
  • Weibin Xu, Rongfu Jin and Shuangwu Huang,and Shiwang Zhu “Study on Biomedical   Properties of Carbon-Fiber  Reinforced Polysulfones for Skull Prosthesis”, Fiber Composites, Vol. 4, 1995
  • Weibin Xu, Rongfu Jin and Shuangwu Huang,and Shiwang Zhu “A New Method to Prepare Carbon-Fiber Reinforced Polysulfones for Skull Prosthesis”, Fiber Composites, vol. 2, 1994
  • Jianjun Wei, Jianping Xu, YilunZhou, Jiwen Xu, Qiongyin Cai and Shuangwu Huang, “Medical Analysis of Carbon-Fiber Reinforced Polysulfones for Skull Prosthesis”, Chinese Journal of Stereotactic and Functional Neurosurgery , vol.1. 1992
  • Shuangwu Huang, Cai and Jin “Study on Carbon-Fiber Reinforced Polysulfones for Skull Prosthesis”, Asia/Australia Polymer Processing Society Meeting, Shanghai, P51, Oct.15-18, 1991
  • Shuangwu Huang, Cai and Jin “Preparation and Properties of Carbon-Fiber Reinforced Polysulfones”, Asia/Australia Polymer Processing Society Meeting, Shanghai, P12, Oct.15-18, 1991

 

专利发明

                 美国50 个(封装材料和工艺技术),新加坡2个(纳米材料)和中国专利 16个

               (封装技术)部分专利发明如下:

  • 晶圆级封装:Castellation Wafer Level Packaging of Integrated Circuit chips,

              美国专利号:6855572, 6949407,7271027,7276387,7528477,7679179,8008126,

                                        7193312, 7304375

  • 多芯片晶圆级封装:Multichip Wafer Level Packaging,

             美国专利号:6825553, 6964881, 7485562

  • 多芯片半导体封装:Multichip Chip Semiconductor Package,

      美国专利号:6958537, 7553697, 7173330, 7553697, 6987031, 7087992

  • CMOS图像传感器封装:Encapsulated imager packaging, 美国专利申请号:  20090179290
  • 低应力UBM/介电层封装工艺:Semiconductor Die and Method of Forming Compliant Polymer Layer Between UBM and Conformal Dielectric Layer/RDL for Stress Relief,

             美国专利号:  8017515

  • Z-互连导电柱与内聚合物芯封装工艺:Semiconductor Die and Method of Providing Z-interconnect Conductive Pillars with Inner Polymer Core,  美国专利号:  8133762
  • 半导体芯片外围有机通孔封装工艺:Semiconductor Die and Method of Forming Through Organic Vias Having Varying Width in Peripheral Region of the Die,  美国专利号: 8258010
  • 芯片周边通孔吸音方法,Semiconductor Die and Method of Forming Noise Absorbing Region Between THVS in Peripheral Region of the Die, 美国专利号:8093151
  • 集成电路屏蔽封装制造方法,Integrated Circuit Packaging System with Shielded Package and Method of Manufacture Thereof,  美国专利号8304286
  • 半导体垂直互连结构制造方法,Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps, 美国专利号: 8193034
  • 无载体薄晶圆芯片封装工艺,Semiconductor Die and Method of Forming a thin Layer Wafer  Without a Carrier, 美国专利号: 8,531,015

兴趣特长

               生物识别新材料的研发,纳米材料的研发和应用,高分子材料在电子行业中应用,

                  封装工艺整合,尖端封装技术

新产品开发

  • Hermetic LCP nanocomposites series (高致密性液晶高分子纳米复合材料系列)
  • Hermetic epoxy resin sealants series (高致密性环氧树脂密封胶系列)
  • Heat-resistant UV adhesives series (耐高温紫外光固化粘合剂系列)

获奖情况

 

  • 美光半导体(Micron)专利发明奖 2003, 2004 & 2005
  • 美光半导体 (Micron) 最佳学术论文奖 2002, 2003, & 2006 (非公开)
  • 2014 苏州阳澄湖科技领军人才
  • 2015年苏州姑苏领军人才
  • 2015年江苏省双创人才
  • 2016年入选创业型国家千人计划

国际会议任职

  • 新加坡电子封装技术大会晶圆级分会委员: 2013-2014

http://www.eptc-ieee.net/tc.html

  • 中国半导体技术大会专家委员会委员2012-2013,封装分会主席2012.

http://www.semiconchina.org/article_1839_824.htm

© Copyright 2005-2012 MediaSoC Lab. All Rights Reserved. 沪交ICP备2010926 [旧版入口]

技术支持:维程互联